As Taiwan continues to lead the global semiconductor industry, advanced packaging technologies such as 2.5D and fan-out wafer-level packaging (FOWLP) are rapidly evolving. These innovations demand ultra-reliable underfill processes to ensure consistent performance and high yield. One key factor that directly impacts yield in Taiwan’s smart fabs is glue control accuracy, especially when dealing with precision processes such as underfill and chip underfill (CUF).

In particular, achieving ±3% glue volume accuracy is critical to maintaining the integrity of microstructures, reducing stress on sensitive components, and ensuring the optimal flow and curing consistency of adhesives. So, how can Taiwan’s semiconductor manufacturers achieve this level of precision in their advanced packaging lines?

The Solution: SS101 Advanced Wafer-Level Dispensing System

The SS101 Advanced RDL First WLP Underfill Wafer-Level Dispensing Machine is designed to meet the stringent demands of modern semiconductor packaging, offering manufacturers a reliable and high-precision dispensing solution. Specifically optimized for wafer-level underfill and CUF processes in fan-out and RDL First scenarios, the SS101 offers a controlled dispensing environment where ±3% glue volume accuracy is consistently maintained.

Key Advantages:

• Optimized for Underfill: Purpose-built for underfill and CUF applications in advanced semiconductor packaging, including 2.5D and FOWLP.
• Automated Workflow: Supports fully automated wafer handling, from loading and alignment to dispensing and heat dissipation, reducing human error and improving efficiency.
• Cleanroom Compatibility: Fully compatible with Class 10 cleanrooms within a Class 1000 fab environment, ensuring contamination-free operations.
• Precise Thermal Control: Maintains stable wafer temperatures, ensuring that the glue flows consistently and cures reliably, which is essential for stress-free bonding of microstructures and bumps.
• Open Communication Protocol: Seamlessly integrates with factory management systems, supporting unmanned operations and smart fab initiatives.

This precision in glue dispensing not only optimizes the flow of underfill material but also reduces the risk of voids, delaminations, and stress-induced damage—critical factors that affect yield and overall chip reliability.

Conclusion

For Taiwan’s advanced semiconductor fabs, ±3% glue volume accuracy is not just a luxury—it is essential for achieving high yield and ensuring that next-gen semiconductor packaging processes meet rigorous performance standards. The SS101 Advanced Wafer-Level Dispensing System provides the ideal solution for precise underfill applications, offering stability, automation, and smart factory integration.

By adopting high-precision dispensing systems like the SS101, Taiwanese manufacturers can enhance production quality, reduce waste, and maintain a competitive edge in the global semiconductor market. As packaging technologies continue to evolve, precision in glue dispensing will remain a critical factor in meeting the demands of the industry’s next wave of innovation.