On March 25, the annual semiconductor industry event SEMICON China and Productronica China will kick off at the Shanghai New International Expo Center. This year, Mingseal Technology will present core achievements in precision dispensing, placement, and water-guided laser technology, demonstrating comprehensive solutions for semiconductor packaging and precision electronics. Experience our technology firsthand and explore feasible solutions to micrometer-level process challenges.
As a key semiconductor exhibition in Asia, the event attracts nearly 900 exhibitors and over 45,000 professional visitors. Mingseal Technology will showcase its innovations at the COEX Exhibition Center, attracting client interest with tailored solutions and technical expertise.
Mingseal Technology focuses on providing semiconductor solutions that adapt to production-line needs for AI and heterogeneous integration. Our offerings cover mainstream packaging processes such as Wafer-Level Packaging (WLP), Panel-Level Packaging (PLP), FCBGA, and SiP, effectively supporting critical procedures including chip underfilling and flux spraying.
Key Products:
SS101 Wafer-Level Dispensing System: Supports full automation for 8/12-inch wafers with temperature stability for advanced packaging.
SS300 Panel-Level Dispensing System: Efficiently operates on large panels, addressing warping issues with flexible control.
GS600SUA Underfill Dispensing Machine: Delivers high accuracy for underfilling processes in FCBGA and SiP packaging.
SS400 Heatsink Solution: Compatible with various thermal materials for precise chip assembly.
Our precision electronics solutions cover fields like consumer electronics, MiniLED, and smart wearables.
Core Value: We offer diverse dispensing solutions that balance efficiency and precision.
Key Products:
FS700FDA Dual-Drive Dispensing Machine: Enhances efficiency with synchronous or asynchronous valve operations.
FS200A Dual-Station Visual Dispensing Machine: Provides a cost-effective online dispensing solution for precision assembly.
PD500D Five-Axis Dispensing Machine: Meets dispensing needs for complex shapes in VR/AR and mobile applications.
AC100 Precision Dispensing & Placement Machine: Integrates automatic loading and dispensing for complete assembly processes.
Application Areas: Micron-level processing of high-hardness materials.
Core Value: Achieves ultra-precision processing with minimal thermal impact.
Key Product:
MLS300 Ultra-Precision Water-Guided Laser System: Stabilizes high-pressure water and lasers for precise control, making it suitable for aerospace and semiconductor applications.
Mingseal’s vertically integrated product line includes core components to complete systems, showcasing piezoelectric jet valves, eccentric/concentric screw valves, and precision controllers.
Join us as we advance semiconductor technology and foster innovation in the industry! We look forward to seeing you at the exhibition!
On March 25, the annual semiconductor industry event SEMICON China and Productronica China will kick off at the Shanghai New International Expo Center. This year, Mingseal Technology will present core achievements in precision dispensing, placement, and water-guided laser technology, demonstrating comprehensive solutions for semiconductor packaging and precision electronics. Experience our technology firsthand and explore feasible solutions to micrometer-level process challenges.
As a key semiconductor exhibition in Asia, the event attracts nearly 900 exhibitors and over 45,000 professional visitors. Mingseal Technology will showcase its innovations at the COEX Exhibition Center, attracting client interest with tailored solutions and technical expertise.
Mingseal Technology focuses on providing semiconductor solutions that adapt to production-line needs for AI and heterogeneous integration. Our offerings cover mainstream packaging processes such as Wafer-Level Packaging (WLP), Panel-Level Packaging (PLP), FCBGA, and SiP, effectively supporting critical procedures including chip underfilling and flux spraying.
Key Products:
SS101 Wafer-Level Dispensing System: Supports full automation for 8/12-inch wafers with temperature stability for advanced packaging.
SS300 Panel-Level Dispensing System: Efficiently operates on large panels, addressing warping issues with flexible control.
GS600SUA Underfill Dispensing Machine: Delivers high accuracy for underfilling processes in FCBGA and SiP packaging.
SS400 Heatsink Solution: Compatible with various thermal materials for precise chip assembly.
Our precision electronics solutions cover fields like consumer electronics, MiniLED, and smart wearables.
Core Value: We offer diverse dispensing solutions that balance efficiency and precision.
Key Products:
FS700FDA Dual-Drive Dispensing Machine: Enhances efficiency with synchronous or asynchronous valve operations.
FS200A Dual-Station Visual Dispensing Machine: Provides a cost-effective online dispensing solution for precision assembly.
PD500D Five-Axis Dispensing Machine: Meets dispensing needs for complex shapes in VR/AR and mobile applications.
AC100 Precision Dispensing & Placement Machine: Integrates automatic loading and dispensing for complete assembly processes.
Application Areas: Micron-level processing of high-hardness materials.
Core Value: Achieves ultra-precision processing with minimal thermal impact.
Key Product:
MLS300 Ultra-Precision Water-Guided Laser System: Stabilizes high-pressure water and lasers for precise control, making it suitable for aerospace and semiconductor applications.
Mingseal’s vertically integrated product line includes core components to complete systems, showcasing piezoelectric jet valves, eccentric/concentric screw valves, and precision controllers.
Join us as we advance semiconductor technology and foster innovation in the industry! We look forward to seeing you at the exhibition!
