Strategic Preview: From March 11–13, 2026, Mingseal Technology will exhibit at the Chengdu International Industry Fair (CIIF) (Western China International Expo City). As the industry pivots toward Smart Manufacturing and High-Density Packaging, Mingseal will showcase three flagship product lines: Precision Dispensing, Die Attach/Placement, and Water-Jet Guided Laser Processing, providing vertically integrated solutions for the semiconductor and precision electronics supply chains.

Technical Highlights: Mission-Critical Process Solutions

 
1. Precision Dispensing: Enabling Next-Gen Advanced Packaging (AP)
Mingseal’s dispensing portfolio is engineered for high-yield reliability in Heterogeneous Integration and System-in-Package (SiP) architectures:
Semiconductor Packaging: Specialized solutions for Wafer-Level Packaging (WLP), Panel-Level Packaging (PLP), and Flip-Chip (FCBGA/FCCSP). Key Processes: High-speed Underfill, Dam & Fill, Flux Jetting, and Solder Paste Micro-patterning.

Featured Systems: SS101 (WLP), SS300 (PLP), GS600SU (High-Accuracy Underfill), and GS700SU (Large-Die Underfill).

Precision Electronics: High-throughput solutions for CCM (Camera Control Modules), VCM (Voice Coil Motors), AR/VR Optics, and MiniLED Coating.

Featured Systems: FS700FDA (High-precision dual-drive/four-valve) and PD500D (5-axis linkage for complex 3D dispensing).

2. Precision Mounting: High-Accuracy Die Attach & Assembly

Our placement systems address the "Zero-Defect" requirements of AI Chip and Sensor Assembly:
Application Scope: Optimized for Lid Attachment, Indium/Thermal Interface Material (TIM) Attachment, and Ring Attachment in FCBGA lines. It also covers precision Optical Component Placement (Prisms, Lens Holders).

Featured Systems: SS200/SS400 (Advanced Heatsink & Lid Attachment Solutions) and the AC100 (High-flexibility Dispensing & Placement Integrated System).
 

3. Water-Jet Guided Laser: Cold Processing for High-Value Substrates

The MLS300 Ultra-Precision Water-Jet Guided Laser System represents the pinnacle of "Cold Micro-machining" for brittle and high-hardness materials.
Material Compatibility: SiC (Silicon Carbide), GaN (Gallium Nitride), Ceramic Substrates, and Synthetic Diamond Heat Sinks.
Technical Advantage: Our proprietary Laser-Water Coupling Head maintains a stable fiber-like water jet, achieving ±10μm accuracy with zero heat-affected zones (HAZ), crucial for aerospace and high-end semiconductor dicing.

 
Global Reach, Local Expertise: New Chengdu Subsidiary

Mingseal is accelerating its "Global Service, Local Support" strategy with the official opening of our Chengdu Subsidiary on March 23, 2026.
This facility serves as a Center of Excellence for the Southwest China market, focusing on:
Process Verification & Testing: On-site labs for Advanced Packaging and Precision Electronics validation.
Technical Lifecycle Support: Rapid-response field engineering and localized spare parts inventory.
Application Engineering: Collaborative solution development to optimize client Total Cost of Ownership (TCO).
Service Network:
Headquartered in Changzhou, Mingseal’s footprint extends across China and key international hubs including Japan, Korea, Vietnam, India, Thailand, Singapore, and Mexico.
Visit Us:

Expo: CDIIF 2026 

Booth Number: 16H B021
Date: March 11–13, 2026
Location: Western China International Expo City (Chengdu)
New Office: 1F, Bldg 7, No. 6 Chengye Rd, Chenghua District, Chengdu, Sichuan.