As the demands for advanced display technology and compact packaging continue to evolve, the industry requires exact and reliable dispensing systems for FoPLP (Fan-out Panel-Level Packaging) processes. Our flagship SS300 Panel-Level Dispensing System has emerged as the first domestically produced dispenser specifically designed for FoPLP applications in Taiwan, setting a new standard in panel-level encapsulation technology.

Application Focus and Key Process Capabilities

The SS300 is specially engineered to meet the rigorous requirements of FoPLP processes, including:

Underfill Dispensing: Ensuring void-free encapsulation for enhanced device stability.
Coating: Precise application of protective and functional coatings on large panel areas.
Flux Spray: Uniform flux application for soldering and bonding processes.
Designed for versatility, the SS300 provides seamless support for multiple process needs with high accuracy and consistency.

Panel Compatibility and Size Range

The SS300 Panel-Level Dispensing System is compatible with large-format panels, supporting dimensions of 510×515mm and 600×600mm.
This broad compatibility allows manufacturers to adapt to various substrate sizes, improving production flexibility and throughput.

Superior Warpage Resistance

Our SS300 system boasts an exceptional warpage compensation capability of ±10mm, enabling accurate dispensing on panels with slight deformation or bending. This feature ensures consistent application across the entire panel, regardless of warping issues commonly encountered during large-format manufacturing.

Industry Impact and Benefits

The introduction of the SS300 as Taiwan’s first domestically developed FoPLP dispensing solution has revolutionized local panel-level packaging. Key benefits include:

• Enhanced Precision: Achieving high-accuracy dispensing is critical for reliable device performance.
• Increased Efficiency: Faster setup times and optimized process flow reduce production costs.
• Improved Reliability: Consistent application on large panels leads to fewer reworks and higher yields.
• Domestic Innovation: Supports local manufacturing by reducing reliance on imported equipment.

Conclusion

The SS300 Panel-Level Dispensing System is a groundbreaking achievement in Taiwan’s advanced packaging industry. It provides manufacturers with a reliable, versatile, and precise solution tailored for FoPLP applications, elevating the quality and consistency of panel-level encapsulation.

If you're looking to improve your FoPLP process with a proven, domestically developed system, the SS300 is your ideal choice. Contact us today to learn more about how the SS300 can optimize your panel-level packaging operations.