Brief: Discover the High Viscosity Semiconductor Concentric Screw Valve for Dispensing, an advanced solution for precision applications in the semiconductor industry. Ideal for underfill, epoxy, and thermal interface materials, this valve ensures stable, repeatable dispensing with minimal waste. Perfect for die attach, SiP module bonding, and microelectronic encapsulation.
Related Product Features:
Closed-loop servo motor ensures precise positioning with 98% dispensing repeatability and a minimum dispensing amount of 0.1ul.
Syringe guide installation design allows quick removal and replacement of 10/30/50ml syringes for easy operation.
Special negative pressure controller reduces the lower viscosity limit of applicable media to 2000cps.
Supports both continuous bead dispensing and precision dotting with clean cut-off and minimal material waste.
Integrates seamlessly with automated lines to meet strict reliability and yield requirements in advanced packaging.
Stainless steel stator and tungsten steel screw ensure durability and long-term performance.
Compact valve dimensions (37 ×230×85mm) and controller (240 × 100×260mm) for easy integration.
Features instant suction, RS-232C communication, and Chinese & English display switching for versatile use.
Faqs:
What semiconductor materials can the concentric screw valve handle?
It is suitable for high-viscosity materials, silicone, TIMs, and gap fillers used in advanced packaging.
Can it perform both dot dispensing and continuous line dispensing?
Absolutely. It supports both precision dot placement and continuous bead paths, making it flexible for various packaging steps.
What are the key advantages of the concentric screw valve?
Key advantages include precise positioning with 98% repeatability, quick syringe replacement, and compatibility with materials as low as 2000cps viscosity.