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Jetting Valve​
Created with Pixso. High Frequency Jetting Valve​ Piezo Jet Valve For IC And Sensor Packaging

High Frequency Jetting Valve​ Piezo Jet Valve For IC And Sensor Packaging

Brand Name: Mingseal
Model Number: KPS2000-K
MOQ: 1
Price: $4500-$10000 / pcs
Delivery Time: 7-60days
Payment Terms: L/C,D/P,T/T,Western Union,D/A
Detail Information
Place of Origin:
China
Certification:
ISO, ROHS
Product Name:
KPS2000-K Dispensing Jetting Valve​
Core Parts:
Flow Heating Channel, Glue Barrel Heating Module
Applicable Viscosity:
1~500,000 Cps
Frequency:
1~1200 HZ
Minimum Dot Diameter:
0.15mm (depends On The Glue)
Minimum Line Width:
0.17mm (depends On The Glue)
Minimum Glue Spraying Amount:
0.5nl
Weight:
4-5 KG
Repeatability:
0.01mm
Packaging Details:
Carton/Wooden box
Supply Ability:
200sets per month
Highlight:

High frequency Jetting Valve​

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IC Packaging Jetting Valve​

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Sensor Packaging piezo jet valve

Product Description

High frequency Piezo Jet Valve Solutions for IC and Sensor Packaging Applications

 
Piezo jet valves enable ultra-precise, non-contact adhesive dispensing for semiconductor IC and sensor packaging. Ideal for underfill, die attach, and MEMS sealing, they handle low-to-high viscosity materials with nanoliter precision. With high-speed jetting, excellent repeatability, and easy integration, piezo valves improve yield and efficiency in advanced packaging lines.
The piezoelectric jetting valve is an ideal solution for semiconductor and high-precision dispensing applications requiring high-speed piezo jetting performance.
 
 
Core Advantages

 

  • High-precision micro-control non-contact dispensing
  • High-frequency jetting capability to improve the packaging production line rhythm
  • Compatible with a variety of glues and can be applied to different processes
  • Simple maintenance design, easy to clean nozzles, improve equipment stability
  • Adapt to temperature changes, more stable

 
Main appliaction

 

  1. Application in IC packaging process
  •  Underfill dispensing
  •  Edge Encapsulation
  •  Die Attach dispensing
  •  Wafer Level packaging dispensing

 

     2. Sensor (MEMS, pressure, image sensor) packaging application

  • Chip fixing & sealing dispensing
  • Transparent cover bonding
  • Multi-component glue precise dispensing

 
 
Technical parameters
 

KPS2000-K adhesive dispensing valves​
Minimum glue spraying amount0.5nl(CPK>1.33)
Glue ViscosityMedium or high viscosity up to 500,000mpas
Max jetting frequency1200Hz
Corrosion resistanceAll aqueous media, organic solvents, weak acids and weak bases
Valve Size

125.5×40×20mm(No runner assembly included)
125.5×75×20mm(Includes runner assembly)

Valve Weight430g(With fluid box, no cables)
KPC2000 controller
AC power inputAC 220V±20%
 0.01ms~6000.00ms,0.01ms
Jetting frequency1~1200HZ 
Settings displayTFT color screen
 10 set
Reserved interfaceSupports RS232/RS485 
Controller Weight3.55KG
Controller Size232×170×165 mm
Power275W

 
FAQ
 
Q1: What materials can a piezo jet valve dispense in IC or sensor packaging?
A1: Piezo jet valves can handle a wide range of materials, including underfill epoxy, die attach adhesive, silicone sealants, and UV-curable resins. They support viscosities from 1 to 50,000 mPa·s with excellent repeatability.
 
Q2: How does non-contact dispensing benefit semiconductor and MEMS assembly?
A2: Non-contact dispensing prevents mechanical damage to delicate structures like bare dies or MEMS sensors. It also allows precise adhesive placement in narrow gaps and complex geometries.
 
Q3: Can piezo valves be used in high-throughput packaging lines?
A3: Yes. With jetting speeds exceeding 1000Hz, piezo jet valves are ideal for high-volume production. They maintain consistent dot size, reduce cycle time, and integrate easily with automation and vision systems.
 
Q4: How do piezo valves ensure cleanliness and reliability in cleanroom environments?
A4: Piezo valves are designed with minimal dead volume, easy-to-clean nozzles, and sealed structures to prevent contamination. 
 
 
About Mingseal
 
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.
Partner with Mingseal to power the future of automatic manufacturing!