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Jetting Valve​
Created with Pixso. High Precision Non-contact Piezo Jet Valve with 0.5nl Minimum Spray for IC and Sensor Packaging

High Precision Non-contact Piezo Jet Valve with 0.5nl Minimum Spray for IC and Sensor Packaging

Brand Name: Mingseal
Model Number: KPS2000-K
MOQ: 1
Price: $4500-$10000 / pcs
Delivery Time: 7-60days
Payment Terms: L/C,D/P,T/T,Western Union,D/A
Detail Information
Place of Origin:
China
Certification:
ISO, ROHS
Product Name:
KPS2000-K Dispensing Jetting Valve​
Core Parts:
Flow Heating Channel, Glue Barrel Heating Module
Applicable Viscosity:
1~500,000 Cps
Frequency:
1~1200 HZ
Minimum Dot Diameter:
0.15mm (depends On The Glue)
Minimum Line Width:
0.17mm (depends On The Glue)
Minimum Glue Spraying Amount:
0.5nl
Weight:
4-5 KG
Repeatability:
0.01mm
Packaging Details:
Carton/Wooden box
Supply Ability:
200sets per month
Highlight:

High frequency Jetting Valve​

,

IC Packaging Jetting Valve​

,

Sensor Packaging piezo jet valve

Product Description
High Frequency Jetting Valve Piezo Jet Valve For IC And Sensor Packaging
High frequency Piezo Jet Valve Solutions for IC and Sensor Packaging Applications

Piezo jet valves enable ultra-precise, non-contact adhesive dispensing for semiconductor IC and sensor packaging. Ideal for underfill, die attach, and MEMS sealing, they handle low-to-high viscosity materials with nanoliter precision. With high-speed jetting, excellent repeatability, and easy integration, piezo valves improve yield and efficiency in advanced packaging lines.

The piezoelectric jetting valve is an ideal solution for semiconductor and high-precision dispensing applications requiring high-speed piezo jetting performance.
Core Advantages
  • High-precision micro-control non-contact dispensing
  • High-frequency jetting capability to improve the packaging production line rhythm
  • Compatible with a variety of glues and can be applied to different processes
  • Simple maintenance design, easy to clean nozzles, improve equipment stability
  • Adapt to temperature changes, more stable performance
Main Application
Application in IC packaging process
  • Underfill dispensing
  • Edge Encapsulation
  • Die Attach dispensing
  • Wafer Level packaging dispensing
Sensor (MEMS, pressure, image sensor) packaging application
  • Chip fixing & sealing dispensing
  • Transparent cover bonding
  • Multi-component glue precise dispensing
Technical Parameters
KPS2000-K adhesive dispensing valves
Minimum glue spraying amount 0.5nl(CPK>1.33)
Glue Viscosity Medium or high viscosity up to 500,000mpas
Max jetting frequency 1200Hz
Corrosion resistance All aqueous media, organic solvents, weak acids and weak bases
Valve Size 125.5×40×20mm(No runner assembly included)
125.5×75×20mm(Includes runner assembly)
Valve Weight 430g(With fluid box, no cables)
KPC2000 controller
AC power input AC 220V±20%
Jetting frequency 1~1200HZ
Settings display TFT color screen
Reserved interface Supports RS232/RS485
Controller Weight 3.55KG
Controller Size 232×170×165 mm
Power 275W
FAQ
Q1: What materials can a piezo jet valve dispense in IC or sensor packaging?
A1: Piezo jet valves can handle a wide range of materials, including underfill epoxy, die attach adhesive, silicone sealants, and UV-curable resins. They support viscosities from 1 to 50,000 mPa*s with excellent repeatability.
Q2: How does non-contact dispensing benefit semiconductor and MEMS assembly?
A2: Non-contact dispensing prevents mechanical damage to delicate structures like bare dies or MEMS sensors. It also allows precise adhesive placement in narrow gaps and complex geometries.
Q3: Can piezo valves be used in high-throughput packaging lines?
A3: Yes. With jetting speeds exceeding 1000Hz, piezo jet valves are ideal for high-volume production. They maintain consistent dot size, reduce cycle time, and integrate easily with automation and vision systems.
Q4: How do piezo valves ensure cleanliness and reliability in cleanroom environments?
A4: Piezo valves are designed with minimal dead volume, easy-to-clean nozzles, and sealed structures to prevent contamination.
About Mingseal
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.

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