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| Brand Name: | Mingseal |
| Model Number: | FS600F |
| MOQ: | 1 |
| Price: | $28000-$150000 / pcs |
| Delivery Time: | 5-60 Days |
| Payment Terms: | ,L/C,D/A,D/P,T/T,Western Union |
High-Performance Hot Melt Glue Solution for Smart Device Assembly
As demand for smaller, lighter, and stronger consumer electronics continues to grow, precision bonding with hot melt adhesives has become vital for manufacturers of TWS earbuds, smartphone mid-frames, and plastic housings. Challenges such as controlling glue width, achieving uniform coverage, and verifying bonding quality require smarter, more flexible dispensing systems.
The Mingseal FS600 series Dispensing Machine is designed to help modern factories master these challenges. With an advanced piezoelectronic valve, the system precisely handles hot melt adhesives with excellent flow control — ideal for fast, clean bonding lines.
Key Advantages
Typical Applications
✔ Housing bonding for TWS earbuds and wireless devices
✔ Mid-frame bonding for smartphones and tablets
✔ Plastic casing assembly for wearables or smart accessories
✔ Structural reinforcement with hot melt glue for electronic shells
✔ Edge sealing or spot bonding in portable electronic modules
Technical Specifications
| FS600F Inline Visual Dispensing Machine | |
|---|---|
| Frame | Floor-mounted gantry 3-axis |
| Dimensions | 770 × 1200 × 1450 mm |
| Weight | 800 kg |
| Power Supply | 220V AC 50Hz |
| Power | 2.8 KW |
| Air | (0.5 Mpa, 250 L/min) ×2 |
| Ambient Temperature | 23℃ ±5℃ |
| Humidity | 20 ~ 90% RH |
| Motion System | X/Y: Linear motor; Z: Servo motor & screw |
| Repeatability | X/Y: ±0.01 mm; Z: ±0.005 mm |
| Positioning Accuracy | X/Y: ±0.02 mm; Z: ±0.01 mm |
| Max Speed | X/Y: 1300 mm/s; Z: 500 mm/s |
| Max Acceleration | X/Y: 1.3 g; Z: 0.5 g |
| Visual System | Mark recognition |
| Weighing Accuracy | 0.1 mg / 0.01 mg |
| Track Load | 3 kg |
| Track Width | 35–520 mm adjustable |
| Substrate Thickness | 0.5–9 mm |
FAQ
Q1: Why choose a piezo valve for hot melt adhesives?
A: Piezo valves respond faster than traditional pneumatic valves and handle high-viscosity glues with precise flow control, giving cleaner glue lines and less waste.
Q2: How does 3D inspection improve bonding quality?
A: 3D scanning checks glue dot height and width in real time, helping operators catch missing spots, overflow, or gaps that 2D cameras may overlook.
Q3: Can the machine control glue dot width?
A: Yes, the system supports adjustable glue width— critical for tight spaces in earbud shells or mid-frame edges where overflow can cause assembly problems.
Q4: Is it easy to integrate with existing lines?
A: Absolutely — the FS600F meets SECS-GEM and SMEMA standards for smooth connection to MES systems and other inline equipment.
Q5: Where is Mingseal’s FS600 series used today?
A: Leading manufacturers across Southeast Asia, India, and Korea rely on this system for high-speed bonding in TWS, smartphone frames, and plastic casing production.
About Mingseal
Mingseal specializes in next-generation glue dispensing solutions for the global electronics industry. With a focus on smart process modules, real-time inspection, and tight process control, we help manufacturers achieve higher yields, better bonding strength, and flexible line integration — all backed by fast local support.
Contact Mingseal now to get a custom FS600F bonding plan for your hot melt glue project — and take your production precision to the next level!
