On March 28, 2025, the curtain closed on two of the electronics industry’s most anticipated exhibitions—SEMICON China and Productronica China—at the Shanghai New International Expo Centre. For the first time, the two events were held concurrently, covering the full semiconductor value chain and core areas of electronic manufacturing, from chip design and advanced packaging to SMT, robotics, and smart production.

Focusing on the dual themes of Advanced Semiconductor Packaging and Smart Electronics Manufacturing, this year’s shows gathered over 100,000+ visitors and global tech leaders, making it a world-class hub for innovation, technical exchange, and commercial collaboration.

 
Mingseal: “Precision + Intelligence” Drives Innovation

Mingseal Technology stood out at both shows with a powerful presence, showcasing cutting-edge dispensing solutions under the theme of "Precision + Intelligence". Our booths drew thousands of visitors from leading semiconductor packaging firms, consumer electronics giants, and top research institutions, all eager to explore Mingseal’s high-accuracy, automation-ready systems.

 
Semiconductor Packaging: Localized Innovation for Global Standards

At SEMICON China, SS101 Wafer-Level Dispensing System and GS600SUA Jet Dispensing Platform drew strong interest from top-tier OSAT companies and global semiconductor leaders.

SS101 is specially designed for RDL-First FoWLP processes and supports CoWoS, FoPoP and other advanced packaging technologies. Featuring automated wafer loading/unloading and high-precision thermal control, SS101 has emerged as a flagship product in the domestic equipment substitution wave.

GS600SUA utilizes intelligent thermal management and advanced timing control to tackle voiding issues in FCBGA/FCCSP dispensing. With yield performance exceeding international benchmarks, the system earned multiple cooperation intents during the show.

Smart Consumer Electronics: Miniaturization Meets Precision

In the field of precision consumer electronics, FS200A Inline Visual Dispenser and PD500D Five-Axis System became major highlights:

PD500D leverages spatial arc interpolation for accurate dispensing on curved or irregular surfaces, solving key assembly challenges for AR/VR and TWS devices.

FS700FDA, a quad-valve high-efficiency platform, was also on display. With ±1% glue volume accuracy and double productivity, it attracted live trials from MiniLED manufacturers.

Additionally, Mingseal showcased core components such as PJS/KPS Piezoelectric Jet Valves, KDC Controllers, and KSV Series Screw Valves, known for their cost-effective localization and suitability for scaling smart production in small to mid-sized factories.

 
Industry Recognition: Best New Product Award

During the BRAND NEW Awards Ceremony at Productronica China, Mingseal was honored with the "Most Popular New Product" award, recognizing our continued leadership in innovative dispensing technology.

 
Global Connections, Future Vision

Our booths were filled with engaged customers, industry experts, and technical collaborators. Many praised Mingseal’s ability to integrate micron-level precision with AMHS-compatible smart automation, calling it a “true leap from follower to global frontrunner in Chinese intelligent manufacturing.”

Mingseal also entered strategic dialogues with semiconductor leaders and international companies from Germany, Japan, and beyond—further proving the global competitiveness of China’s precision manufacturing.