From January 22 to 24, 2025, the Tokyo International Exhibition Center hosted NEPCON JAPAN 2025, one of Asia’s largest and most influential exhibitions for electronics manufacturing and semiconductor technology. With over 2,250 exhibitors and 110,000+ global buyers from countries including China, Japan, South Korea, Singapore, the U.S., Germany, and more, the event brought together the top players in automotive electronics, semiconductors, smart manufacturing, and advanced assembly.

As Mingseal Technology’s first international showcase of 2025, the exhibition marked a powerful debut with the release of two global product premieres and the spotlight on multiple high-performance dispensing and jetting systems, reinforcing our commitment to advancing intelligent precision manufacturing.

Global Debut of KSC5000 Controller and KPS4000 Jet Valve

At Booth E17-7 in Hall 2, Mingseal introduced two key innovations that drew wide attention from industry experts and buyers:

KSC5000 Precision Dispensing Controller
Designed to optimize glue consistency at high-speed transitions, the KSC5000 offers excellent control over corner points, start/stop zones, and complex motion paths. It ensures even dispensing across all segments, dramatically improving stability and precision in demanding applications.

KPS4000 Non-Contact Jetting System

Tailored for high-speed, high-precision applications, the KPS4000 handles a wide viscosity range — from low to ultra-high — and is available in UV-resistant, corrosion-proof, and PUR-compatible configurations.
Its seal-less nozzle design reduces consumables and simplifies maintenance, while the ADJ calibration system ensures repeatability of up to 0.01 mm, even after 20 million cycles. Combined with advanced screw-lock alignment and real-time monitoring capabilities, the KPS4000 sets a new benchmark for non-contact jetting in the semiconductor and electronics industries.

Flagship Dispensing Machines: FS700FDA & FS600A

FS700FDA High-Speed Quad-Valve System

This system targets advanced encapsulation, dam & fill, flip-chip underfill, and FPC reinforcement. It is widely adopted in FPC, SMT, MiniLED, MEMS, and BGA applications. The system supports complex multi-valve operations and ensures high throughput under precision-intensive conditions.

FS600A Vision-Guided Inline Dispenser
Designed for smart, high-precision dispensing, FS600A features a highly configurable platform for encapsulation, bonding, filling, and assembly tasks. It supports MES system integration, enabling real-time production traceability, anomaly alerts, and seamless process control. Its flexibility and quick model-switching capability make it ideal for diverse, multi-process manufacturing scenarios.

Highlighted Systems & Accessories

At the booth, Mingseal also showcased a range of star products:

• VS300 Desktop Visual Dispensing Machine – All-in-one system with integrated glue AOI, 360° rotation, and intuitive interface
• DW200P Precision Resistance Welding System – Developed for wire welding, metal joining, and plastic riveting in electronics
• KSP/KDP Screw Valve Series – One- and two-component volumetric valves for high-precision fluid control
• PJS100H & KPS2000 Jetting Valves – Designed for high-viscosity and high-speed non-contact dispensing
• KSV1000 Series – Quantitative dispensing screw valve for particle-filled and mid-to-high viscosity fluids

These systems serve a wide range of applications in semiconductors, camera modules, thermal management, automotive cameras, and LED packaging, positioning Mingseal as a one-stop solution provider for precision fluid control.

On-Site Interaction & Global Impact

The live demonstrations and real-time process explanations at the booth enabled attendees to experience Mingseal's technological depth and application advantages firsthand. Our team engaged in productive discussions with both new and existing partners, exploring customized solutions and future collaboration opportunities.

Many customers expressed deep interest in our innovations, citing our systems’ operational stability, process intelligence, and low maintenance costs as standout strengths. This successful showcase reaffirmed Mingseal’s growing presence in the global market and its role in shaping the future of smart electronics manufacturing.

Looking Ahead

Mingseal Technology thanks every guest who visited our booth during NEPCON JAPAN 2025. We look forward to building deeper partnerships, delivering smarter solutions, and driving forward the global shift toward intelligent, high-precision manufacturing.