Mingseal is excited to introduce the SS200 Lid Attachment System, specially designed for the FCBGA (Flip Chip Ball Grid Array) ring attachment process. This innovative system supports an array of thermal interface materials, including thermal grease, indium foils, no-clean flux indium foils, graphene, diamond, and composite diamond materials, ensuring optimal heat dissipation for advanced semiconductor packaging.
The SS200 system is engineered to handle a wide range of package sizes, accommodating anything from 5mm × 5mm to 110mm × 110mm. With a maximum boat size of 340mm × 340mm and a weight capacity of up to 3kg (including the product), this system is ideal for high-performance applications in the electronics industry. The modular design allows for customization according to specific process requirements, enabling users to adjust and rearrange workstations as needed.
Equipped with a dual-track configuration, the SS200 supports the SnapCure unit, which can hold up to five thermal pressing tools simultaneously. This feature enables precise lid attachment with a maximum pressing force of 400kg, ensuring robust thermal connections are achieved efficiently. The system's capability to employ magazine-style and tray loading methods, as well as optional belt feeding and customizable soft tray options, enhances operational flexibility and efficiency.
Designed to operate under optimal conditions of 25℃±5℃ and 30-70% humidity, the SS200 is built for reliability in various manufacturing environments. With a footprint of 5870mm × 1650mm × 2100mm and a system weight of 5.8 tons, it integrates seamlessly into existing production lines without disrupting workflows.
The SS200 Lid Attachment System has already shown promising results in practical applications in Taiwan, where it has contributed to improving the efficiency and quality of FCBGA packaging processes. By utilizing advanced technology and precision engineering, Mingseal is committed to addressing the challenges faced in modern semiconductor manufacturing.
With the SS200 Lid Attachment System, manufacturers can enhance their thermal management processes in FCBGA applications, ensuring better heat dissipation and overall device performance. Investing in this advanced system positions companies at the forefront of semiconductor packaging technology. For more information about the SS200 and how it can benefit your operations, please visit our website or contact us today!
Mingseal is excited to introduce the SS200 Lid Attachment System, specially designed for the FCBGA (Flip Chip Ball Grid Array) ring attachment process. This innovative system supports an array of thermal interface materials, including thermal grease, indium foils, no-clean flux indium foils, graphene, diamond, and composite diamond materials, ensuring optimal heat dissipation for advanced semiconductor packaging.
The SS200 system is engineered to handle a wide range of package sizes, accommodating anything from 5mm × 5mm to 110mm × 110mm. With a maximum boat size of 340mm × 340mm and a weight capacity of up to 3kg (including the product), this system is ideal for high-performance applications in the electronics industry. The modular design allows for customization according to specific process requirements, enabling users to adjust and rearrange workstations as needed.
Equipped with a dual-track configuration, the SS200 supports the SnapCure unit, which can hold up to five thermal pressing tools simultaneously. This feature enables precise lid attachment with a maximum pressing force of 400kg, ensuring robust thermal connections are achieved efficiently. The system's capability to employ magazine-style and tray loading methods, as well as optional belt feeding and customizable soft tray options, enhances operational flexibility and efficiency.
Designed to operate under optimal conditions of 25℃±5℃ and 30-70% humidity, the SS200 is built for reliability in various manufacturing environments. With a footprint of 5870mm × 1650mm × 2100mm and a system weight of 5.8 tons, it integrates seamlessly into existing production lines without disrupting workflows.
The SS200 Lid Attachment System has already shown promising results in practical applications in Taiwan, where it has contributed to improving the efficiency and quality of FCBGA packaging processes. By utilizing advanced technology and precision engineering, Mingseal is committed to addressing the challenges faced in modern semiconductor manufacturing.
With the SS200 Lid Attachment System, manufacturers can enhance their thermal management processes in FCBGA applications, ensuring better heat dissipation and overall device performance. Investing in this advanced system positions companies at the forefront of semiconductor packaging technology. For more information about the SS200 and how it can benefit your operations, please visit our website or contact us today!
