From September 10–12, SEMICON Taiwan 2025 concluded successfully at the Taipei Nangang Exhibition Center, attracting global attention as one of the semiconductor industry’s largest and most influential events of the year. With the theme “Partnering for a World of Innovation”, the exhibition brought together more than 1,200 companies, featured over 4,100 booths, and welcomed 100,000+ professional visitors. Topics such as AI chips, advanced packaging, heterogeneous integration, 3DIC, panel-level packaging (FOPLP), Chiplets, and co-packaged optics (CPO) took center stage, highlighting the industry’s rapid evolution.

Mingseal’s Focus on Advanced Packaging and Dispensing Solutions

At this year’s show, Mingseal Technology presented its latest portfolio of high-precision dispensing and mounting systems, designed to meet the needs of panel-level package(PLP), wafer-level package (WLP), and system-in-package (SiP) applications. These solutions attracted strong interest from engineers, manufacturers, and technology partners throughout the exhibition.

SS300 Panel-Level Dispensing System

The SS300 panel-level dispensing system integrates automatic loading/unloading and high-precision dispensing. It is optimized for RDL First FoPLP processes, enabling underfill applications with advanced features such as panel preheating, mitigated warpage, and AOI glue-shape inspection. The SS300 also supports multiple automation interfaces including PGV, AGV, and OHT, aligning with the industry’s shift toward intelligent, unmanned semiconductor production lines.

SS101 Wafer-Level Dispensing System

The SS101 wafer-level dispensing system targets the requirements of RDL First FOWLP processes in CoWoS, FoPoP, and other advanced packaging technologies. By integrating wafer handling, alignment, preheating, jet dispensing, and thermal management into one platform, the SS101 enhances both precision and stability. The system supports AMHS robotic loading/unloading, further strengthening production continuity and efficiency.

MLS300 Ultra-Precision Water-Guided Laser System

For the first time, Mingseal unveiled the MLS300 water-guided laser machining system, a breakthrough in ultra-hard and composite material processing. The MLS300 can perform cutting, drilling, and coring on materials such as ceramics, diamonds, and silicon carbide (SiC), with accuracy controlled within ±10 μm. This solution provides critical support for semiconductor material processing and quickly became a highlight at the booth, attracting attention from global visitors.

Core Fluid Control Components

In addition to full-system solutions, Mingseal showcased its piezo jet valves, eccentric screw valves, and two-phase spray valves. These precision dispensing components demonstrate Mingseal’s technical depth in fluid control, underfill, and coating applications, offering versatile options for semiconductor and microelectronics manufacturing lines.

Driving Innovation and Collaboration in the Semiconductor Industry

As a leading platform for global semiconductor collaboration, SEMICON Taiwan not only fosters innovation across the supply chain but also builds bridges between technology providers and customers worldwide. Mingseal leveraged this event to highlight its comprehensive capabilities, spanning from advanced packaging and thermal management to ultra-precision water-guided laser machining.

Through in-depth discussions with customers and partners, Mingseal explored future technology roadmaps and identified new opportunities for cooperation in areas such as micro-precision electronics assembly, semiconductor packaging, and intelligent automation systems.

Looking Ahead

Mingseal will continue to advance its R&D in semiconductor packaging, precision dispensing, and microfabrication technologies, while expanding its global presence. By working closely with customers and partners, the company aims to contribute to the technical progress and application expansion of the semiconductor industry.

For more information on Mingseal’s solutions, please visit: www.mingsealdispenser.com