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van de soort gebruikt bij de vervaardiging van motorvoertuigen

Hot Melt Dispenser Machine

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Created with Pixso. Huis Created with Pixso. Nieuws Created with Pixso.

Mingseal to Showcase Precision Semiconductor Solutions at SEMICON KOREA 2026

Mingseal to Showcase Precision Semiconductor Solutions at SEMICON KOREA 2026

2026-02-04

Seoul, South Korea — February 11–13, 2026 — Mingseal Technology will exhibit its latest precision manufacturing equipment at SEMICON KOREA 2026, Asia’s premier semiconductor trade show, held at COEX Convention & Exhibition Center.

laatste bedrijfsnieuws over Mingseal to Showcase Precision Semiconductor Solutions at SEMICON KOREA 2026 0

Visitors to Booth DS35 (Hall D) can preview turnkey solutions for advanced packaging, wafer processing, and high‑precision assembly designed to increase yield and throughput across semiconductor fabs and OSATs in Korea and the broader Asia Pacific region.


Key highlights on display:


  • MLS300 ultra‑precision water‑guided laser system for ceramics, SiC substrates and wafer micro‑machining — 10 μm accuracy and ≤5 μm thermal impact zone.
  • High‑precision dispensing and underfill platforms (SS101, SS300, GS600SUA) supporting WLP, PLP, FCBGA, FCCSP and SiP processes with ±0.02 mm control, temperature compensation, and inline PDI inspection.
  • Automated heatsink placement solutions (SS200, SS400) for TIM1/TIM1.5/TIM2 workflows targeting AI/HPC and high‑power packaging.


Mingseal’s SEMICON KOREA presence underscores its commitment to precision manufacturing and sustainable process improvements for semiconductor assembly and advanced packaging. Engineers, production managers and procurement teams are invited to arrange on‑site demos and technical briefings to explore customized solutions for Korean fabs, EMS providers and global supply chains.


For booth inquiries and demo appointments, contact Mingseal or visit the company website.

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Nieuwsdetails
Created with Pixso. Huis Created with Pixso. Nieuws Created with Pixso.

Mingseal to Showcase Precision Semiconductor Solutions at SEMICON KOREA 2026

Mingseal to Showcase Precision Semiconductor Solutions at SEMICON KOREA 2026

Seoul, South Korea — February 11–13, 2026 — Mingseal Technology will exhibit its latest precision manufacturing equipment at SEMICON KOREA 2026, Asia’s premier semiconductor trade show, held at COEX Convention & Exhibition Center.

laatste bedrijfsnieuws over Mingseal to Showcase Precision Semiconductor Solutions at SEMICON KOREA 2026 0

Visitors to Booth DS35 (Hall D) can preview turnkey solutions for advanced packaging, wafer processing, and high‑precision assembly designed to increase yield and throughput across semiconductor fabs and OSATs in Korea and the broader Asia Pacific region.


Key highlights on display:


  • MLS300 ultra‑precision water‑guided laser system for ceramics, SiC substrates and wafer micro‑machining — 10 μm accuracy and ≤5 μm thermal impact zone.
  • High‑precision dispensing and underfill platforms (SS101, SS300, GS600SUA) supporting WLP, PLP, FCBGA, FCCSP and SiP processes with ±0.02 mm control, temperature compensation, and inline PDI inspection.
  • Automated heatsink placement solutions (SS200, SS400) for TIM1/TIM1.5/TIM2 workflows targeting AI/HPC and high‑power packaging.


Mingseal’s SEMICON KOREA presence underscores its commitment to precision manufacturing and sustainable process improvements for semiconductor assembly and advanced packaging. Engineers, production managers and procurement teams are invited to arrange on‑site demos and technical briefings to explore customized solutions for Korean fabs, EMS providers and global supply chains.


For booth inquiries and demo appointments, contact Mingseal or visit the company website.