Vietnam has rapidly become a global center for notebook and mobile electronics manufacturing. As device designs continue to shrink, manufacturers rely on flexible printed circuits (FPCs) to support thinner structures and denser signal transmission. These FPC components require chip coating encapsulation and protective filling to ensure durability and long-term reliability, especially in high flex areas.

However, the traditional dispensing process in FPC assembly often causes inconsistent glue volume, slow cycle time, and frequent rework when using low-temperature curable adhesives. To solve these challenges, a leading electronics manufacturer in Vietnam implemented the FS600DDF Dual Valve Inline Dispensing Equipment with piezoelectric jet valve technology.

 
Inline Dual Valve Dispensing for Higher Production Speed

The FS600DDF is engineered to meet high-throughput production lines. A dual valve configuration allows two dispensing points in parallel, significantly improving UPH. The motion system supports fast acceleration and stable accuracy even on ultra-thin notebook FPC substrates.

With piezoelectric jetting, the system can dispense contact-free free ensuring:

• Material consistency for chip coating and protective filling
• Controlled fluid behavior for low-temperature curing adhesives
• Clean edge finish without overflow or splashing
• Better protection of sensitive FPC circuits

This upgrade allowed the factory to confidently reach 100000 units per day 24h operation, fulfilling the customer’s high-volume manufacturing plan.

 
Production Results Verified in Vietnam

After introducing the FS600DDF system the factory reported:

•  Productivity increased to 10w pcs per 24h with stable takt time
•  Precise glue volume control reduced repair and inspection workload
•  Excellent compatibility with low-temperature thermal-curing epoxy
•  Lower adhesive waste and better coating reliability
•  Inline automation reduced labor dependency and improved traceability

These results demonstrate how automated dispensing can help Vietnam manufacturers strengthen quality while reducing operational cost in FPC assembly.

Enabling the Next Stage of Vietnam Electronics Manufacturing

With international notebook brands continuing to expand their supply network in Vietnam factories are upgrading from manual to smart automation solutions to remain competitive. The FS600DDF Dual Valve Inline Dispensing Equipment supports that transition with high speed and high stability micro dispensing performance.

By helping local manufacturers meet advanced packaging and reliability standards the FS600DDF plays a key role in accelerating Vietnam’s transformation into a high performance electronics production powerhouse in Southeast Asia.