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Jetting Valve​
Created with Pixso. Piezoelectric Jetting Valve System Actuator For Underfill Process In Advanced Packaging

Piezoelectric Jetting Valve System Actuator For Underfill Process In Advanced Packaging

Brand Name: Mingseal
Model Number: KPS2000-KS
MOQ: 1
Price: $4500-$10000 / pcs
Delivery Time: 7-60days
Payment Terms: L/C,D/P,T/T,Western Union,D/A
Detail Information
Place of Origin:
China
Certification:
ISO, ROHS
Product Name:
KPS2000-KS High Precision Piezoelectric Jetting Valve​
Core Parts:
Flow Heating Channel, Glue Barrel Heating Module
Applicable Viscosity:
1~500,000 Cps
Minimum Dot Diameter:
0.15mm (depends On The Glue)
Minimum Line Width:
0.17mm (depends On The Glue)
Minimum Glue Spraying Amount:
0.5nl
AC Power Input:
AC 220V±20%
Repeatability:
0.01mm
Warranty:
1year
Packaging Details:
Carton/Wooden box
Supply Ability:
200sets per month
Highlight:

Advanced packagingJetting Valve​

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0.15mm Jetting Valve​

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220V piezoelectric valve actuator

Product Description

High accurancy Piezoelectric Jetting Valve System for underfill process in Advanced packaging

 

Mingseal’s KPS2000-KS piezo jet valve is optimized for high-precision underfill applications in advanced semiconductor packaging. Featuring a refined valve body structure and nanoliter-level dispensing control, it ensures excellent dot consistency, reduced voids, and improved capillary flow for flip chip and wafer-level packages. Its non-contact jetting design supports high-speed, automated underfill processes with superior accuracy and repeatability.

 

Core Advantages

 

  • Non-contact injection, high frequency, high response
  • Micro-precision control, nanoliter glue volume control, high glue consistency
  • High-precision valve body structure and flow channel design to ensure consistency and guarantee packaging yield
  • The temperature control system can be integrated to maintain a constant glue temperature, improve capillary flow efficiency, speed up bottom filling, and adapt to chips of different sizes.

 

Main appliaction

  • Edge Underfill
  • Corner Fill / Pre-dispense
  • Local repair glue

 

Technical parameters

 

KPS2000-KS adhesive dispensing valves​
Minimum glue spraying amount 0.5nl(CPK>1.33)
Glue Viscosity Medium or high viscosity up to 500,000mpas
Max jetting frequency 1200Hz
Corrosion resistance All aqueous media, organic solvents, weak acids and weak bases
Valve Size

125.5×40×20mm(No runner assembly included)

125.5×75×20mm(Includes runner assembly)

Valve Weight 430g(With fluid box, no cables)
KPC2000 controller
AC power input AC 220V±20%
  0.01ms~6000.00ms,0.01ms
Jetting frequency 1~1200HZ 
Settings display TFT color screen
  10 set
Reserved interface Supports RS232/RS485 
Controller Weight 3.55KG
Controller Size 232×170×165 mm
Power 275W

 


FAQ

 

Q1: Can piezo jet valves handle low-viscosity underfill materials used in flip chip packaging?
A1: Yes. Piezo jet valves, such as the Mingseal KPS2000-KS, are specifically designed to dispense low-viscosity underfill materials with nanoliter precision. They support smooth, consistent flow and precise control, essential for capillary-driven underfill processes.

 

Q2:How does the valve ensure consistent dot volume during long production runs?
A2: The valve features a high-precision nozzle structure and optimized flow path to ensure repeatable dot volumes with deviation less than ±2%. Closed-loop control and high-frequency actuation maintain uniform performance even during high-speed, continuous operation.

 

 

About Mingseal

 

Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.


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