Mingseal Technology exhibits a range of optical communications solutions at the 27th China International Optoelectronic Expo (CIOE), taking place Sept. 9–11, 2026 at the Shenzhen World Exhibition & Convention Center (Bao’an). Visitors are invited to Booth 10B26 in Hall 10 to learn about Mingseal’s precision dispensing, mounting and ultra‑precision water-jet guided laser processing technologies for optical module manufacturing.

Focused exhibits and applications Mingseal presents systems and components aimed at silicon photonic PICs, optical and electrical chips, silicon photonic modules, high‑speed optical modules and CPO optical engines. The company’s offerings cover end‑to‑end process needs — precision dispensing, accurate placement and water‑jet‑guided laser machining — to support stable, scalable production in optoelectronics.

Highlighted dispensing systems

Two new dispensing solutions for optical module packaging will be on display:

• FS600S Underfill Dispensing Machine: Engineered for SiP and high‑speed optical modules, the FS600S targets underfill processes for silicon photonic PICs, DSPs and TIAs. Precise adhesive control reduces void rates and improves long‑term reliability for optoelectronic chips.
• FS700S Inline Vision Dispensing Machine: Featuring an integrated 3D line‑scan vision module and a work envelope up to 350 × 280 mm, the FS700S measures workpiece height in real time and dynamically compensates dispensing volume. The system supports a closed loop of measurement–dispensing–inspection and adapts to underfill, FA adhesive replenishment and lens reinforcement processes.

Additional process solutions 

Mingseal will also demonstrate equipment that addresses a broad range of optical packaging needs:

• FS200A Dual‑Station Vision Dispensing Machine: A high‑precision, multi‑head dispensing platform suitable for packaging, reinforcement and bonding of CCM/VCM and FPC components.
• PD500D Five‑Axis Linkage Dispensing Machine: Offers five‑axis motion and spatial circular interpolation for complex 3D coating on irregular housings and VR/AR optical assemblies.
• AC100 Precision Dispensing & Placement Machine: Integrates dispensing inspection, component placement and pre‑curing to support both dispense‑then‑place and place‑then‑dispense workflows for automated package assembly.
• VS Series Benchtop Vision Dispensing Machine: Delivers dispensing accuracy of ±0.025 mm with optional rotation/tilt modules, glue AOI inspection and an automatic glue cleaning system to prevent stringing.
• Water‑jet‑guided laser processing The MLS300 Ultra‑Precision Water‑Jet‑Guided Laser System enables micron‑level machining of hard, brittle materials commonly used in optical communications — such as ceramic substrates and silicon carbide. With ±10 μm precision and a heat‑affected zone ≤5 μm, the system minimizes thermal damage and produces smooth, burr‑free edges for thermal management substrates and optical components.

Core fluid control components 

Mingseal will highlight its core fluid control hardware, including the KDC Series Precision Dispensing Controller. The controller supports both positive‑pressure dispensing and negative‑pressure suction‑back with an output range of 0.005–0.7 MPa, covering low to high viscosity fluids. A full lineup of valves — piezo jet, screw, spray and piston — will also be presented to meet a wide spectrum of dispensing and coating needs.

Event information

Date: September 9–11, 2026

Venue: Shenzhen World Exhibition & Convention Center (Bao’an) 

Booth: Hall 10, Booth 10B26

About Mingseal 

Mingseal Technology develops precision fluid control systems and advanced manufacturing equipment for optoelectronics and related industries. The company offers integrated solutions spanning core components, equipment and automated production lines to support high‑volume, high‑reliability manufacturing.